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| 0.35 CMOS 1.65 V to 3.6 V Single SPDT Switch/2:1 MUX ADG839 FEATURES 1.65 V to 3.6 V operation Ultralow on resistance: 0.35 typical 0.5 max at 2.7 V supply Excellent audio performance, ultralow distortion: 0.055 typical 0.09 max RON flatness High current carrying capability: 300 mA continuous 500 mA peak current at 3.3 V Automotive temperature range: -40C to +125C Rail-to-rail switching operation Typical power consumption (<0.1 W) FUNCTIONAL BLOCK DIAGRAM ADG839 S2 D S1 IN 04449-001 SWITCHES SHOWN FOR A LOGIC 1 INPUT Figure 1. APPLICATIONS Cellular phones PDAs MP3 players Power routing Battery-powered systems PCMCIA cards Modems Audio and video signal routing Communication systems PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. 0.6 over full temperature range of -40C to +125C. Compatible with 1.8 V CMOS logic. High current handling capability (300 mA continuous current at 3.3 V). Low THD + N (0.01% typ). Tiny SC70 package. GENERAL DESCRIPTION The ADG839 is a low voltage CMOS device containing a singlepole, double-throw (SPDT) switch. This device offers ultralow on resistance of less than 0.6 over the full temperature range. The ADG839 is fully specified for 1.8 V, 2.5 V, and 3.3 V supply operation. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. The ADG839 exhibits break-before-make switching action. The ADG839 is available in a 6-lead SC70 package. Table 1. ADG839 Truth Table Logic 0 1 Switch 2 (S2) Off On Switch 1 (S1) On Off Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 (c) 2004 Analog Devices, Inc. All rights reserved. ADG839 TABLE OF CONTENTS Specifications--2.7 V to 3.6 V ........................................................ 3 Specifications--2.3 V to 2.7 V ........................................................ 4 Specifications--1.65 V to 1.95 V .................................................... 5 Absolute Maximum Ratings............................................................ 6 ESD Caution.................................................................................. 6 Pin Configuration and Function Descriptions............................. 7 Typical Performance Characteristics ..............................................8 Terminology .................................................................................... 11 Test Circuits..................................................................................... 12 Outline Dimensions ....................................................................... 14 Ordering Guide .......................................................................... 14 REVISION HISTORY 10/04--Initial Version: Revision 0 Rev. 0 | Page 2 of 16 ADG839 SPECIFICATIONS1--2.7 V TO 3.6 V VDD = 2.7 V to 3.6 V, GND = 0 V, unless otherwise noted. Table 2. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match between Channels (RON) On Resistance Flatness (RFLAT (ON)) LEAKAGE CURRENTS Source Off Leakage IS (OFF) Channel On Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tON tOFF Break-Before-Make Time Delay (tBBM) Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion (THD + N) Insertion Loss -3 dB Bandwidth CS (OFF) CD, CS (ON) POWER REQUIREMENTS IDD +25C -40C to +85C -40C to +125C 0 V to VDD 0.35 0.5 0.04 0.075 0.055 0.07 0.2 0.2 2 0.8 0.005 0.1 3.2 12 16 6.5 8.5 5 70 -57 -57 0.013 -0.01 25 74 120 0.003 1 4 0.56 0.085 0.082 0.61 0.095 0.09 Unit V typ max typ max typ max nA typ nA typ V min V max A typ A max pF typ ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ % dB typ MHz typ pF typ pF typ A typ A max VIN = VINL or VINH Test Conditions/Comments VDD = 2.7 V VDD = 2.7 V, VS = 0 V to VDD, IS = 100 mA; Figure 19 VDD = 2.7 V, VS = 0.9 V, IS = 100 mA VDD = 2.7 V, VS = 0 V to VDD, IS = 100 mA VDD = 3.6 V VS = 0.6 V/3.3 V, VD = 3.3 V/0.6 V; Figure 20 VS = VD = 0.6 V or 3.3 V; Figure 21 18 9 19 9.5 1 RL = 50 , CL = 35 pF VS = 1.5 V/0 V; Figure 22 RL = 50 , CL = 35 pF VS = 1.5 V; Figure 22 RL = 50 , CL = 35 pF; Figure 23 VS1 = VS2 = 1.5 V; VS = 1.5 V, RS = 0 , CL = 1 nF; Figure 24 RL = 50 , CL = 5 pF, f = 100 kHz; Figure 25 S1 -S2; RL = 50 , CL = 5 pF, f = 100 kHz; Figure 26 RL = 32 , f = 20 Hz to 20 kHz, VS = 3 V p-p RL = 50 , CL = 5 pF; Figure 27 RL = 50 , CL = 5 pF; Figure 27 VDD = 3.6 V Digital inputs = 0 V or 3.6 V 1 2 Temperature range for the Y version is -40C to +125C. Guaranteed by design; not subject to production test. Rev. 0 | Page 3 of 16 ADG839 SPECIFICATIONS1--2.3 V TO 2.7 V VDD = 2.5 V 0.2 V, GND = 0 V, unless otherwise noted. Table 3. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match between Channels (RON) On Resistance Flatness (RFLAT (ON)) LEAKAGE CURRENTS Source Off Leakage IS (OFF) Channel On Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tON tOFF Break-before-Make Time Delay (tBBM) Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion (THD + N) Insertion Loss -3 dB Bandwidth CS (OFF) CD, CS (ON) POWER REQUIREMENTS IDD +25C -40C to +85C -40C to +125C 0 V to VDD 0.35 0.5 0.04 0.075 0.045 0.55 0.085 0.13 0.2 0.2 1.7 0.7 0.005 0.1 3.2 14.5 18 7.5 9.2 7 60 -57 -57 0.021 -0.01 25 78 127 0.003 1 4 0.6 0.095 0.13 Unit V typ max typ max typ max nA typ nA typ V min V max A typ A max pF typ ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ % dB typ MHz typ pF typ pF typ A typ A max VIN = VINL or VINH Test Conditions/Comments VDD = 2.3 V, VS = 0 V to VDD, IS = 100 mA; Figure 19 VDD = 2.3 V, VS = 0.95 V, IS = 100 mA VDD = 2.3 V, VS = 0 V to VDD, IS = 100 mA VDD = 2.7 V VS = 0.6 V/2.4 V, VD = 2.4 V/0.6 V; Figure 20 VS = VD = 0.6 V or 2.4 V; Figure 21 20 9.5 21 9.8 1 RL = 50 , CL = 35 pF VS = 1.5 V/0 V; Figure 22 RL = 50 , CL = 35 pF VS = 1.5 V; Figure 22 RL = 50 , CL = 35 pF; Figure 23 VS1 = VS2 = 1.5 V; VS = 1.25 V, RS = 0 , CL = 1 nF; Figure 24 RL = 50 , CL = 5 pF, f = 100 kHz; Figure 25 S1-S2; RL = 50 , CL = 5 pF, f = 100 kHz; Figure 26 RL = 32 , f = 20 Hz to 20 kHz, VS = 2 V p-p RL = 50 , CL = 5 pF; Figure 27 RL = 50 , CL = 5 pF; Figure 27 VDD = 2.7 V Digital inputs = 0 V or 2.7 V 1 2 Temperature range for the Y version is -40C to +125C. Guaranteed by design; not subject to production test. Rev. 0 | Page 4 of 16 ADG839 SPECIFICATIONS1--1.65 V TO 1.95 V VDD = 1.65 V 1.95 V, GND = 0 V, unless otherwise noted. Table 4. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) +25C -40C to +85C -40C to +125C 0 V to VDD 0.5 0.8 1.3 0.04 0.075 0.3 0.2 0.2 0.65 VDD 0.35 VDD 0.005 0.1 CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tON tOFF Break-before-Make Time Delay (tBBM) Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion (THD + N) Insertion Loss -3 dB Bandwidth CS (OFF) CD, CS (ON) POWER REQUIREMENTS IDD 3.2 20 28 8 10.1 12 50 -57 -57 0.033 -0.01 25 83 132 0.003 1 4 1.2 2.5 0.08 1.2 2.5 0.08 Unit V typ max max typ max typ nA typ nA typ V min V max A typ A max pF typ ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ % dB typ MHz typ pF typ pF typ A typ A max VIN = VINL or VINH Test Conditions/Comments On Resistance Match between Channels (RON) On Resistance Flatness (RFLAT (ON)) LEAKAGE CURRENTS Source Off Leakage IS (OFF) Channel On Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH VDD = 1.8 V, VS = 0 V to VDD, IS = 100 mA; Figure 19 VDD = 1.65 V, VS = 0 V to VDD, IS = 100 mA VDD = 1.65 V, VS = TBD, IS = 100 mA IS = 100 mA VDD = 1.65 V, VS = 0 V to VDD, IS = 100 mA VDD = 1.95 V VS = 0.6 V/1.65 V, VD = 1.65 V/0.6 V; Figure 20 VS = VD = 0.6 V or 1.65 V; Figure 21 30 10.5 31 10.7 1 RL = 50 , CL = 35 pF VS = 1.5 /0 V; Figure 22 RL = 50 , CL = 35 pF VS = 1.5 V; Figure 22 RL = 50 , CL = 35 pF VS1 = VS2 = 1 V; Figure 23 VS = 1 V, RS = 0 V, CL = 1 nF; Figure 24 RL = 50 , CL = 5 pF, f = 100 kHz; Figure 25 S1 -S2; RL = 50 , CL = 5 pF, f = 100 kHz; Figure 26 RL = 32 , f = 20 Hz to 20 kHz, VS = 1 V p-p RL = 50 , CL = 5 pF; Figure 27 RL = 50 , CL = 5 pF; Figure 27 VDD = 1.95 V Digital inputs = 0 V or 1.95 V Digital inputs = 0 V or 1.95 V 1 2 Temperature range for the Y version is -40C to +125C. Guaranteed by design; not subject to production test. Rev. 0 | Page 5 of 16 ADG839 ABSOLUTE MAXIMUM RATINGS TA = 25C, unless otherwise noted. Table 5. Parameter VDD to GND Analog Inputs1 Digital Inputs Peak Current, S or D 3.3 V Operation 2.5 V Operation 1.8 V Operation Continuous Current, S or D 3.3 V Operation 2.5 V Operation 1.8 V Operation Operating Temperature Range Automotive (Y Version) Storage Temperature Range Junction Temperature SC70 Package JA Thermal Impedance Lead Temperature, Soldering (10 seconds) IR Reflow, Peak Temperature 1 Rating -0.3 V to +4.6 V -0.3 V to VDD + 0.3 V -0.3 V to 4.6 V or 10 mA, whichever occurs first 500 mA 460 mA 420 mA (pulsed at 1 ms, 10% duty cycle max) 300 mA 275 mA 250 mA -40C to +125C -65C to +150C 150C 332C/W 120C/W 300C 220C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. ___________________________________________________________ Overvoltages at S or D are clamped by internal diodes. Current should be limited to the maximum ratings given. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. 0 | Page 6 of 16 ADG839 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS IN 1 VDD 2 6 S2 5D TOP VIEW GND 3 (Not to Scale) 4 S1 ADG839 Figure 2. Pin Configuration Table 6. Pin Function Descriptions Pin No. 1 2 3 4, 6 5 Mnemonic IN VDD GND S1, S2 D Description Logic control input. Most positive power supply potential. Ground (0 V) reference. Source terminal. Can be an input or output. Drain terminal. Can be an input or output. For more information, refer to the Terminology section. Rev. 0 | Page 7 of 16 04449-002 ADG839 TYPICAL PERFORMANCE CHARACTERISTICS 0.40 VDD = 3.0V 0.35 VDD = 3.3V 0.30 0.50 0.45 0.40 VDD = 3.6V 0.25 0.20 0.15 0.10 0.10 04449-022 04449-025 +125C +85C +25C -40C ON RESISTANCE () ON RESISTANCE () 0.35 0.30 0.25 0.20 0.15 0.05 TA = 25C 0 0 0.5 1.0 1.5 2.0 VD, VS (V) 2.5 3.0 3.5 VDD = 3.3V 0.05 0 0 0.5 1.0 1.5 2.0 VD, VS (V) 2.5 3.0 Figure 3. On Resistance vs. VD (VS) VDD = 3 V to 3.6 V Figure 6. On Resistance vs. VD (VS) for Different Temperature, VDD = 3.3 V 0.45 VDD = 2.3V 0.40 VDD = 2.5V 0.35 0.6 0.5 +125C +85C ON RESISTANCE () ON RESISTANCE () 0.30 VDD = 2.7V 0.25 0.20 0.15 0.10 0.4 0.3 +25C -40C 0.2 0.1 0.05 TA = 25C 0 0 0.5 1.0 1.5 VD, VS (V) 2.0 2.5 04449-023 VDD = 2.5V 0 0 0.5 1.0 1.5 VD, VS (V) 2.0 2.5 Figure 4. On Resistance vs. VD (VS) VDD = 2.5 V 0.2 V Figure 7. On Resistance vs. VD (VS) for Different Temperature, VDD = 2.5 V 0.8 VDD = 1.65V 0.7 0.6 0.7 +125C 0.6 +25C +85C 0.5 ON RESISTANCE () 0.5 0.4 VDD = 1.95V 0.3 0.2 04449-024 ON RESISTANCE () VDD = 1.80V 0.4 -40C 0.3 0.2 0.1 VDD = 1.8V 0 0 0.2 0.4 0.6 0.8 1.0 VD, VS (V) 1.2 1.4 1.6 1.8 TA = 25C 0 0 0.2 0.4 0.6 0.8 1.0 1.2 VD, VS (V) 1.4 1.6 1.8 2.0 Figure 5. On Resistance vs. VD (VS) VDD = 1.8 V 0.15 V Figure 8. On Resistance vs. VD (VS) for Different Temperature, VDD = 1.8 V Rev. 0 | Page 8 of 16 04449-027 0.1 04449-026 ADG839 100 VDD = 3.3V 90 80 140 160 VDD = 3.3V 180 TA = 25C 70 CURRENT (nA) 60 50 40 30 20 10 ID, IS (ON) CHARGE INJECTION (pC) 120 100 VDD = 2.5V 80 60 VDD = 1.8V 40 20 0 0 0.5 1.0 1.5 VD (V) 2.0 2.5 3.0 04449-015 0 -10 -40 -20 0 20 40 60 TEMPERATURE (C) 80 100 120 Figure 9. Leakage Current vs. Temperature, VDD = 3.3 V 04449-012 IS (OFF) Figure 12. Charge Injection vs. Source Voltage 80 VDD = 2.5V 70 60 ID, IS (ON) 50 25 tON 20 VDD = 1.8V CURRENT (nA) 40 30 20 10 0 IS (OFF) -10 -40 -20 0 20 40 60 TEMPERATURE (C) 80 100 120 04449-013 TIME (ns) 15 VDD = 2.5V VDD = 3.3V 10 tOFF VDD = 1.8V VDD = 2.5V VDD = 3.3V -20 0 20 40 60 TEMPERATURE (C) 80 100 120 5 0 -40 Figure 10. Leakage Current vs. Temperature, VDD = 2.5 V Figure 13. tON/tOFF Times vs. Temperature 70 VDD = 1.8V 60 ID, IS (ON) 50 1 0 -1 -2 TA = 25C VDD = 3.3V/2.5V/1.8V CURRENT (nA) 40 30 20 10 04449-014 ON RESPONSE (dB) -3 -4 -5 -6 -7 -8 -9 -11 -12 100 1k 10k 100k 1M FREQUENCY (Hz) 10M -10 -40 -20 0 20 40 60 TEMPERATURE (C) 80 100 120 100M Figure 11. Leakage Current vs. Temperature, VDD = 1.8 V Figure 14. Bandwidth Rev. 0 | Page 9 of 16 04449-017 0 IS (OFF) -10 04449-016 ADG839 0 TA = 25C VDD = 3.3V/2.5V/1.8V -20 0.04 0.05 TA = 25C 32 LOAD OFF ISOLATION (dB) -40 VDD = 1.8V; V p-p = 1V -60 THD+N (%) 0.03 -80 0.02 -100 04449-018 VDD = 2.5V; V p-p = 2V -120 100 1k 10k 100k 1M FREQUENCY (Hz) 10M 100M 1G 0.01 10 100 1k FREQUENCY (Hz) 10k 100k Figure 15. Off Isolation vs. Frequency Figure 17. Total Harmonic Distortion + Noise 0 TA = 25C VDD = 3.3V/2.5V/1.8V -20 0 TA = 25C VDD = 3.3V/2.5V/1.8V -20 CROSS TALK (dB) -40 -40 -60 PSRR (dB) -60 -80 -80 -100 04449-019 -100 04449-021 -120 100 1k 10k 100k 1M FREQUENCY (Hz) 10M 100M 1G -120 100 1k 10k FREQUENCY (Hz) 100k 1M Figure 16. Crosstalk vs. Frequency Figure 18. AC PSRR Rev. 0 | Page 10 of 16 04449-020 VDD = 3.3V; V p-p = 3V ADG839 TERMINOLOGY IDD Positive supply current. VD (VS) Analog voltage on Terminals D and S. RON Ohmic resistance between D and S. RFLAT (ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured. RON On resistance match between any two channels. IS (OFF) Source leakage current with the switch off. ID (OFF) Drain leakage current with the switch off. ID, IS (ON) Channel leakage current with the switch on. VINL Maximum input voltage for Logic 0. VINH Minimum input voltage for Logic 1. IINL (IINH) Input current of the digital input. CS (OFF) Off switch source capacitance. Measured with reference to ground. CD (OFF) Off switch drain capacitance. Measured with reference to ground. CD, CS (ON) On switch capacitance. Measured with reference to ground. CIN Digital input capacitance. tON Delay time between the 50% and the 90% points of the digital input and switch on condition. tOFF Delay time between the 50% and the 90% points of the digital input and switch off condition. tBBM On or off time measured between the 80% points of both switches when switching from one to another. Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during on-off switching. Off Isolation A measure of unwanted signal coupling through an off switch. Crosstalk A measure of unwanted signal which is coupled through from one channel to another as a result of parasitic capacitance. -3 dB Bandwidth The frequency at which the output is attenuated by 3 dB. On Response The frequency response of the on switch. Insertion Loss The attenuation between the input and output ports of the switch when the switch is in the on condition, and is due to the on resistance of the switch. THD + N The ratio of the harmonic amplitudes plus noise of a signal to the fundamental. PSRR Power Supply Rejection Ratio. This is a measure of the coupling of unwanted ac signals on the power supply to the switch output when the supply is not decoupled. Rev. 0 | Page 11 of 16 ADG839 TEST CIRCUITS V IS (OFF) ID (OFF) S D A 04449-004 S VS D 04449-003 A ID (ON) VD 04449-005 IDS VS VD NC S D A Figure 19. On Resistance Figure 20. Off Leakage Figure 21. On Leakage VDD 0.1F VIN VDD VS S2 S1 D RL 50 GND VOUT CL 35pF VIN 50% 50% 50% 50% 90% VOUT 90% IN VIN Figure 22. Switching Times, tON, tOFF VDD 0.1F VDD VS S2 S1 VIN D RL 50 GND VOUT CL 35pF VOUT 80% IN VIN 80% tBBM tBBM 04449-007 Figure 23. Break-before-Make Time Delay, tBBM VDD 0.1F VIN (NORMALLY CLOSED SWITCH) VDD S2 VS D S1 IN GND CL 1nF 04449-008 ON OFF NC VOUT VIN (NORMALLY OPEN SWITCH) VOUT VOUT QINJ = CL x VOUT Figure 24. Charge Injection Rev. 0 | Page 12 of 16 04449-006 tON tOFF ADG839 VDD 0.1F NETWORK ANALYZER 50 VS VDD 0.1F NETWORK ANALYZER VOUT S1 RL 50 S2 50 RL 50 VOUT 04449-009 VDD S1 VDD NC S2 50 IN D R 50 D VIN GND VS IN GND OFF ISOLATION = 20 LOG VOUT VS CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG VOUT VS Figure 25. Off Isolation Figure 26. Channel-to-Channel Crosstalk VDD 0.1F NETWORK ANALYZER NETWORK ANALYZER VDD VDD 50mV VDD S1 NC S2 IN 50 VS 50 VS 04449-011 BIAS TEE VDD D VIN GND RL 50 VOUT IN S1 RL 50 NC S2 GND D VOUT 04449-010 VIN NC 04449-028 INSERTION LOSS = 20 LOG VOUT WITH SWITCH VOUT WITHOUT SWITCH Figure 27. Bandwidth Figure 27. PSRR Rev. 0 | Page 13 of 16 ADG839 OUTLINE DIMENSIONS 2.00 BSC 6 5 2 4 1.25 BSC 1 3 2.10 BSC PIN 1 0.65 BSC 1.30 BSC 1.00 0.90 0.70 1.10 MAX 0.22 0.08 0.30 0.15 0.10 COPLANARITY COMPLIANT TO JEDEC STANDARDS MO-203AB SEATING PLANE 8 4 0 0.10 MAX 0.46 0.36 0.26 Figure 28. 6-Lead Thin Shrink Small Outline Transistor Package [SC70] (KS-6) Dimensions shown in millimeters ORDERING GUIDE Model ADG839YKSZ-500RL72 ADG839YKSZ-REEL2 ADG839YKSZ-REEL72 Temperature Range -40C to +125C -40C to +125C -40C to +125C Package Description 6-Lead Thin Shrink Small Outline Transistor Package 6-Lead Thin Shrink Small Outline Transistor Package 6-Lead Thin Shrink Small Outline Transistor Package Package Option KS-6 KS-6 KS-6 Branding1 SUA SUA SUA 1 2 Branding on this package is limited to three characters due to space constraints. Z = Pb-free part. Rev. 0 | Page 14 of 16 ADG839 NOTES Rev. 0 | Page 15 of 16 ADG839 NOTES (c) 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04449-0-10/04(0) Rev. 0 | Page 16 of 16 |
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